WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

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We're in search of an Advanced Packaging Reliability expert to lead AMD's NPI qualification. In this leadership role, you'll collaborate closely with product design and advanced packaging team to assess product-level reliability margins and performance. Your proficiency in identifying failure mechanisms and root causes and developing product lifetime models are essential, and your adaptability and teamwork skills are equally crucial for success in this position.

THE PERSON:

A strong grasp of technology and product qualification, in-depth knowledge of failure physics and mechanisms, expertise in creating reliability models for assessing product lifetimes, and staying updated on cutting-edge industry packaging advancements are all crucial. Adaptability and effective teamwork skills are equally vital for excelling in this role.

KEY RESPONSIBILITIES:

• Lead DfR initiatives, specifically focusing on Advanced Packaging Reliability for AMD's new product offerings.
• Derive mission profile and knowledge-based qualification plans to qualify the next generation products.
• Analyze product qualification data to ensure alignment with established design targets.
• Develop Acceleration Factors for product lifetime assessment.
• Lead reliability failures diagnosis and advocate for design and manufacturing improvements.
• Provide support to team members, customers, and suppliers as necessary.

PREFERRED EXPERIENCE:

• Familiar with advanced monolithic and chiplet packaging technologies such as wafer level packaging, Substrate Technology, CoWoS, InFO, hybrid bonding, and a solid understanding of Si technology fundamentals.
• Knowledgeable about advanced packaging process in OSATs and TSMC, and other industries.

ACADEMIC CREDENTIALS:

• MS or higher in ME, EE or relevant engineering fields.
• Experience in semiconductor and electronics industry.
• Exceptional teamwork skills and a proactive, can-do attitude, outstanding communication abilities.

Location: Austin, TX

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At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD's Employee Stock Purchase Plan. You'll also be eligible for competitive benefits described in more detail .

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.